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Samsung '3D' Memory Coming, 50% Denser

 
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by Open Source News December 8, 2010 05:15 AM

Categories: News, Rumors and Gossip

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"Samsung on Tuesday announced a new 8GB dual inline memory module (DIMM) that stacks memory chips on top of each other, which increases the density of the memory by 50% compared with conventional DIMM technology. Samsung's new registered or buffered (RDIMM) product is based on its current Green DDR3 DRAM and 40 nanometer (nm)-sized circuitry.
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